DELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance Computing

Product Details
Application: Department Level
Instruction System: CISC
Max. CPUs: 2
Diamond Member Since 2025

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Main Products
Server, GPU, SSD, Computer Server, Memory, Rack Server, Computer Part, RAM
Address
Beijing, China
  • DELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance Computing
  • DELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance Computing
  • DELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance Computing
  • DELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance Computing
  • DELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance Computing
  • DELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance Computing
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Basic Info.

Model NO.
R670
Network Connectivity
25Gbps
Number of CPu Threads
20
Power Supply
Redundant PSU
Remote Management
iDRAC
Storage Type
Hybrid Storage(Combination of HDDs and SSDs)
Supporting Memory Capacity
>1TB
System Architecture
X86 Server
Form Factor
1U
Networking
10G Ethernet
Operating System
Windows Server
Processor Type
Intel Core
RAID Support
RAID 10
RAM Capacity
256GB
Storage Capacity
>1TB
Storage Options
HDD
Transport Package
a
Specification
A
Trademark
A
Origin
a

Product Description

 
DELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance ComputingDELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance ComputingDELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance ComputingDELL Poweredge R670 1u Dual-Processor Rack Server, Supporting High-Performance Computing
Components Technical Specifications
Processor Two Intel Xeon 6 processors, with up to 144 E-cores or 86 P-cores per processor
Memory • 32 DDR5 DIMM slots, supporting up to 8 TB of RDIMM at speeds up to 6400 MT/s
• Supports registered ECC DDR5 DIMMs only
Storage Controllers • Internal boot: Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS): HWRAID 1, 2 x M.2 NVMe SSDs or M.2 adapter (DC-MHS): 2 x M.2 NVMe SSDs or USB
• Internal controllers: Front PERC H965i, Front PERC H975i, Front PERC H365i
Front Trays • Backplane-less configuration
• Up to 8 x EDSFF E3.S NVMe, maximum 122.88 TB, with FIO configuration
Up to 16 x EDSFF E3.S Gen5 NVMe, maximum 245.76 TB
• Up to 20 x EDSFF E3.S Gen5 NVMe, maximum 307.2 TB
• Up to 8 x 2.5-inch SAS/SATA/NVMe Direct/NVMe Raid, maximum 122.88 TB
• 8 x 2.5-inch universal drives, 245.6 TB
• Up to 10 x 2.5-inch SAS/SATA, maximum 38.4 TB
• Up to 2 x EDSFF E3.S Gen5 NVMe (rear), maximum 30.72 TB
Hot-Plug Power Supply • 1500 W Titanium 100-240 VAC or 240 VDC
• 1100 W Titanium 100-240 VAC or 240 VDC
• 800 W Titanium 100-240 VAC or 240 VDC
• 1100 W Platinum 100-240 VAC or 240 VDC
• 800 W Platinum 100-240 VAC or 240 VDC
• 1800 W HLAC Titanium 200-240 VAC or 240 VDC*
• 1500 W 277 VAC or 336 VDC*
• 1400 W LVDC -48 - -60 VDC*
Cooling Options • Air cooling and direct liquid cooling
• Reminder: DLC is a rack solution that requires a rack manifold and Cooling Distribution Unit (CDU) to operate.
Fans • High-performance Silver (HPR SLVR) fans or standard (STD) fans
• Up to 4 sets (dual-fan modules) of hot-plug fans
Dimensions and Weight Height - 42.8 mm (1.69 inches)
Width - 482 mm (18.98 inches)
Weight - 20.42 kg (45.02 pounds)
Depth (for rear I/O configuration)
• 816.92 mm (32.20 inches) with bezel
• 815.14 mm (32.09 inches) without bezel
Depth (for front I/O configuration)
• 829.44 mm (32.66 inches) without bezel
Reminder: Front I/O configuration does not support bezel.
Form Factor 1U rack server
Embedded Management • iDRAC
• iDRAC Direct
• iDRAC RESTful API with Redfish
• RACADM CLI
• iDRAC Service Module (iSM)
• Quick Sync 2 wireless module
• NativeEdge endpoint
• NativeEdge Orchestrator
Bezel Optional security bezel
Security • Cryptographically signed firmware
• Static data encryption (SED with local or external key management)
• Secure Boot
• Secure component verification (hardware integrity check)
• Secure Erase
• Silicon root of trust
• System Lockdown
• TPM 2.0 FIPS, CC-TCG certified
• Chassis intrusion detection
Networking Options 4 x OCP NIC 3.0 cards (optional) and 1 GbE, 10 GbE, 25 GbE, 100 GbE, and 400 GbE*
Slots Slot 31: 1 x16 OCP 3.0 on front adapter card
Slot 32: 1 x16 OCP 3.0 on front adapter card
Slot 2: 1 x16 OCP 3.0
Slot 5: 1 x8 Gen5 OCP 3.0 or 1 x16 Gen5 OCP 3.0
BOSS Slot 34: 1 x4 BOSS
Slot 3: 1 x4 BOSS
GPU Options Up to 3 x 75 W SW
Ports Front ports:
• 1 x USB 2.0 Type-C port
• 1 x USB 2.0 Type-A port (optional)
• 1 x Mini-DisplayPort port (optional)
• 1 x DB9 serial port (with front I/O configuration)
• 1 x dedicated Ethernet port for iDRAC management
Rear ports:
• 1 x dedicated Ethernet port for iDRAC management
• 1 x VGA
• 2 x USB 3.1 Type-A ports
Internal ports:
• 1 x USB 3.1 Type-A port
PCIe • Up to 2 x16 Gen5 PCIe slots
• Slot 31: 1 x16 full-height half-length or full-height full-length, or 1 x16 OCP 3.0 on front adapter card
• Slot 32: 1 x16 full-height half-length or full-height full-length, or 1 x16 OCP 3.0 on front adapter card
• Up to 3 x16 or 2 x8 Gen5 PCIe slots
• Slot 1: 1 x16 full-height half-length or full-height full-length, or 3 x16 or 1 x8 half-height half-length
• Slot 2: 1 x16 or 1 x8 half-height half-length, or 1 x16 OCP 3.0
Operating Systems and Hypervisors • Canonical Ubuntu Server LTS
• Microsoft Windows Server with Hyper-V (performance cores only)
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
• VMware ESXi

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